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Monday, July 27, 2020 | History

2 edition of Circuits for adaptive receiver equalization in high-speed chip-to-chip signaling. found in the catalog.

Circuits for adaptive receiver equalization in high-speed chip-to-chip signaling.

Joyce Cheuk Wai Wong

Circuits for adaptive receiver equalization in high-speed chip-to-chip signaling.

by Joyce Cheuk Wai Wong

  • 15 Want to read
  • 32 Currently reading

Published by National Library of Canada in Ottawa .
Written in English


Edition Notes

Thesis (M.A.Sc.) -- University of Toronto, 2003.

SeriesCanadian theses = -- Thèses canadiennes
The Physical Object
Pagination2 microfiches : negative.
ID Numbers
Open LibraryOL21298515M
ISBN 100612842983

K. D. Choquette, C. Chen, A. C. L. Harren, D. M. Grasso, and David V. Plant Link Temperature dependence of optical and structural properties of ferroelectric B Nd Ti 3 O 12 thin film derived by sol–gel process. This banner text can have markup.. web; books; video; audio; software; images; Toggle navigation.

wireless chip-to-chip interconnects using capacitive and inductive coupling are now under development [1],[2]. They are expected to overcome the process cost and low yield problems of the silicon through-via technologies [3]. Another is over 10GHz clock generation and distribution using standing-wave network with inductively loaded. View Arria 10 Device Overview from Intel FPGAs/Altera at Digikey • Adaptive linear and decision feedback equalization Refer to I/O and High Speed I/O in Intel Arria 10 Devices chapter for the number of 3 V I/O, L VDS I/O, and. L VDS channels in each device package.

William Dally is part of Stanford Profiles, official site for faculty, postdocs, students and staff information (Expertise, Bio, Research, Publications, and more). The site facilitates research and collaboration in academic endeavors. High-speed and low-power cellular non-linear networks using single-electron tunneling technology Gerousis, C. / Goodnick, S.M. / Porod, W. / Csurgay, A.I. | digital version print version.


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Circuits for adaptive receiver equalization in high-speed chip-to-chip signaling by Joyce Cheuk Wai Wong Download PDF EPUB FB2

Feature - Equalization in high-speed communication systems Article in IEEE Circuits and Systems Magazine 4(2):4 - 17 February with Reads How we measure 'reads'.

In this work, we propose transmitter and receiver circuits for high‐speed, low‐swing duobinary signaling over active‐terminated chip‐to‐chip interconnect. The authors demonstrate the design of a complete low-power, low-voltage, high-speed, continuous-time adaptive equalizer.

Finally, a cost-effective CMOS receiver which includes the proposed continuous-time adaptive equalizer is designed for Gb/s optical communications through m length, 1-mm diameter plastic optical fiber (POF). speed of integrated circuits (ICs), the bit rates supported by chip-to-chip interconnects must grow at the same pace.

Typically, an electrical chip-to-chip interconnect consists of L parallel lanes connecting L transmitters at the transmitter chip to L receivers at the receiver chip.

Increasing bit rates and associated signal bandwidths. USB was released in Apriladding a higher maximum signaling rate of Mbit/s (60 MB/s) named High Speed or High Bandwidth, in addition to the USB 1.x Full Speed signaling rate of 12 Mbit/s.

Modifications to the USB specification have been made via Engineering Change Notices (ECN).Type: Bus. If you would like to cite any of this material, please use the following: S. Palermo, “CMOS Nanoelectronics Analog and RF VLSI r 9: High-Speed Serial I/O Design for Channel-Limited and Power-Constrained Systems,” McGraw-Hill, File Size: 2MB.

The line levels in each mode of MIPI are shown in Fig. 2 and Table HS mode supports HS data transmission in bursts with synchronous non-return-to-zero (NRZ) signals based on Scalable Low Voltage Signaling (SLVS) ; it transmits a low-voltage-swing differential signal with a common-mode voltage of V.A signaling pair has a bit rate from 80 Mbps to by: 1.

High Speed Digital Design discusses the major factors to consider in designing a high speed digital system and how design concepts affect the functionality of the system as a whole.

It will help you understand why signals act so differently on a high speed digital system, identify the various problems that may occur in the design, and research solutions to minimize their impact and address. CHAPTER 14 HIGH-SPEED I/ INTERFACES Mike Peng Li Wavecrest, San Jose, California T.

Mak Intel Corporation, Santa Clara, California Kwang-Ting (Tim) Cheng University of California, Santa Barbara, California ABOUT THIS CHAPTER Regardless of how complex semiconductor device or chip is, the first thing that has to be dealt with is its pins or input/output (I/O) by: 1.

Chan Carusone, "Equalization and Multilevel Modulation for Multi-Gbps Chip-to-chip Links," in Circuits at the Nanoscale: Communications, Imaging, and Sensing, Editor K.

Iniewski, CRC Press, J. Sewter and A. Chan Carusone, "Equalizer Architectures for Gb/s Optical Systems Limited by Polarization-Mode Dispersion," in High-Speed.

An equalizer provided in a digital transmitter compensates for attenuation in a signal channel to a digital receiver. The equalizer generates signal levels as a logical function of bit history to emphasize transition signal levels relative to repeated signal levels.

The preferred equalizer includes an FIR transition filter using a look-up table. Session High-Speed Digital Circuits FAM A CMOS to K ECL Interlace Circuit; Mark Pederson et al; IEEE International Solid-State Circuits Conference.

Current Mode Transceiver Logic, (CMTL) for Reduced Swing CMOS, Chip to Chip Communication; John H. Quigley et. According to the problem that the traditional clock recovery method based on FPGA can not recover the clock of higher frequency NRZ (Non-return to zero) serial data.

This paper proposed a clock recovery design that adjusts the output clock earlier or later constantly according to the phase relationship between the input data and the feedback : Xiu Li Du, Cun Da Chu, Shao Ming Qiu. Since the CMOS technology scaling has focused on improving digital circuit, the design of conventional analog circuits has become more and more difficult.

To overcome this challenge, there have been a lot of efforts to replace conventional analog circuits with digital implementations. Among those approaches, this paper gives an overview of the latest achievement on utilizing a CMOS inverter as Cited by: 1.

Finally, a low-power yet high-speed chip-to-chip interface scheme, Wireless Superconnect (WSC) scheme is proposed with the density of pins/mm2. The interface utilizes capacitively coupled contact-less mini-pads, return-to-half-V DD signaling and sense amplifying F/F.

TheFile Size: 5MB. Fukaishi et al, “A 20Gb/s CMOS multi-channel transmitter and receiver chip set for ultra-high resolution digital display,” IEEE Inťl Solid-State Circuits Conf. Dig. Tech.

Papers, Febpp. – Google ScholarCited by: 5. The High Speed Electronics Laboratory has published many papers throughout the years. Here is a recent list of publications and patents, written and filed by Professor Chang and the HSEL group.

→ Conference Papers → Journal Papers → Issued Patents. Shen-Iuan Liu (S’88–M’93–SM’F’10) was born in Keelung, Taiwan, Republic of China, He received the B.S.

and Ph.D. degrees in electrical engineering from National Taiwan University (NTU), Taipei, Taiwan, R.O.C., in and–, he served as a second lieutenant in the Chinese Air Force.

circuits (IC) industry with cheaper and higher performance chips. However, these advancements have led to some chips being limited by the chip-to-chip data communication bandwidth. This limitation has motivated research in the area of high-speed links that interconnect chips [21],[37],[47],[52] and has enabled a significant.

Chip-to-Chip Protocol Chip-to-Chip Protocol Chip-to-Chip Protocol Visit MindShare Training at Chapter 5: End-to-End Packets Table lists the four Protocol Layer Header Types and indicates packet direction, type code and number of subtypes. All protocol layer packets consist of headers except for the Data Packet Payload.

In Chapter 7, Prof. Ryuji Kohno of Yokohama National University, Japan, who is also one of the editors for this book introduces a spatial and temporal communication theory based on adaptive antenna array, such as channel modeling, equalization and joint optimization of spatial and temporal signal processing in both transmitter and receiver.A mW 4x10Gb/s Transceiver in 80nm CMOS for High-Density Optical Interconnects (English) A 5Gb/s NRZ transceiver with adaptive equalization for backplane transmission.

Krishnapura, N. / Barazande-Pour, M. / Chaudhry, circuits for high-speed links and clock generators. Tamura, H. / Sung Min Park, | Full text of "Circuit Analysis Theory And Practice" See other formats.